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Ceramic substrate contrast aluminum substrate, copper substrate

Ceramic substrate contrast aluminum substrate, copper substrate

The thermal conductivity of ceramic substrates is relatively high due to the absence of insulating layers. The thermal conductivity of common ceramic substrates is as follows: alumina ceramic substrates: 20-30 W/m · k aluminum nitride ceramic substrates: 170-320 W/m · k silicon nitride ceramic substrates: the theoretical thermal conductivity of single crystal silicon nitride can reach 400W/(m.k). Advantages: ① the thermal conductivity of ceramic substrates is much higher than that of metal substrates such as aluminum and copper; ② because it is not metal materials, ceramic substrates have the best electrical insulation performance. Disadvantages: ① Ceramic substrates are also special materials and need to be customized, and the order production cycle is relatively long; ② Ceramic substrates are brittle, with relatively poor machining performance and relatively low yield after processing; ③ In comparison, the comprehensive cost of ceramic substrates is equivalent to copper substrates.

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2023/07

Comparison of copper substrate and aluminum substrate

Comparison of copper substrate and aluminum substrate

Compared with the aluminum substrate, the copper substrate has the same structure, and both adopt the heat conduction of the insulating layer to transfer heat to the metal substrate, and then rely on the heat dissipation performance of the metal substrate to transfer heat to dissipate. Advantages: ① The overall heat dissipation performance of the copper substrate is about 2 times that of the aluminum substrate; ② The warpage and expansion and contraction of the copper substrate are smaller than those of the aluminum substrate; ① The copper substrate is a special material and needs to be customized, and the order production cycle is relatively long; ② The material cost of copper is about 3 times that of aluminum

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2023/07

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